43rd International Symposium for Testing and Failure Analysis (November 5-9, 2017): http://www.asminternational.org/web/istfa-2017/home

43rd International Symposium for Testing and Failure Analysis (November 5-9, 2017)
November 05 - 09, 2017

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Prof. Christian Boit

Technische Universitaet Berlin
Semiconductor Devices
Berlin Germany 10587

Papers:

STUDENT PAPER: Backside Protection Structure for Security Sensitive ICs
Design for failure analysis in a 24 GHz low-noise amplifier for short range radar applications created in silicon CMOS technology
STUDENT PAPER: Optical Investigations of Temperature Effects in 14/16 nm FinFETs
Photonic Localization Techniques

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General Information

November 05 - 09, 2017


Pasadena, CA