Package and Physical Analysis Challenges I

Sunday, November 5, 2017: 8:00 AM-10:00 AM

Ballroom C (Pasadena Convention Center)

n/a Mr. Chris Richardson, Allied High Tech Products, Inc. and Mr. John Bescup, Weatherford Drilling Services

8:00 AM

Failure Analysis Challenges for Chip Scale Packages
Ms. Susan Li, Cypress Semiconductor

9:00 AM

Flip-Chip and BacksideTechniques
Dr. Edward I. Cole Jr., Sandia National Laboratories

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