Package and Physical Analysis Challenges II

Sunday, November 5, 2017: 2:50 PM-5:20 PM

Ballroom B (Pasadena Convention Center)

n/a Mr. Chris Richardson, Allied High Tech Products, Inc. and Mr. John Bescup, Weatherford Drilling Services

2:50 PM

SAM vs X-RAY
Dr. Thomas M. Moore, Waviks, Inc.

3:50 PM

Package Level Fault Isolation
Dr. Lihong Cao, ASE US Inc

See more of: Tutorial