Fault Isolation II

Sunday, November 5, 2017: 2:50 PM-5:20 PM
Ballroom C (Pasadena Convention Center)
n/a Dr. Mayue Xie, Intel and Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
2:50 PM
Magnetic Imaging for Die and Package Fault Isolation
Mr. David Vallett, PeakSource Analytical, LLC
3:50 PM
FA Technique Selection for Front End Defect Localization in Bulk Semiconductor (Si) FA
Mr. Gregory M. Johnson, GLOBALFOUNDRIES
See more of: Tutorial
<< Previous Session | Next Session >>