Backside Mechanical Preparation Methodology for Effective Failure Analysis on Small and Non-Exposed Die Paddle Package
Backside Mechanical Preparation Methodology for Effective Failure Analysis on Small and Non-Exposed Die Paddle Package
Wednesday, October 31, 2018
Summary:
This paper proposed an alternative solution to the existing procedure on non-exposed die pad backside preparation. The existing procedure exposes the die backside by chemical etching the copper die pad. The drawback of this technique is that the copper lead will etched by the 65% nitric acid if the device is not proper sealed by 3M High Temperature Tape. Therefore, the subsequent electrical measurement is not possible. The proposed method replaces the chemical etching with a mechanical decapsulation (without chemical). The end result observed the copper lead is intact and made possible for an electrical measurement.
This paper proposed an alternative solution to the existing procedure on non-exposed die pad backside preparation. The existing procedure exposes the die backside by chemical etching the copper die pad. The drawback of this technique is that the copper lead will etched by the 65% nitric acid if the device is not proper sealed by 3M High Temperature Tape. Therefore, the subsequent electrical measurement is not possible. The proposed method replaces the chemical etching with a mechanical decapsulation (without chemical). The end result observed the copper lead is intact and made possible for an electrical measurement.