Sample Prep and Device Processing - POSTER

Wednesday, October 31, 2018: 2:20 PM-4:20 PM
Mr. Huei Hao Yap, Globalfoundries Inc. Malta, NY USA and Mr. Ryan Fredrickson, On Semiconductor
Backside Mechanical Preparation Methodology for Effective Failure Analysis on Small and Non-Exposed Die Paddle Package
Ms. Pei Hoon Ong, Infineon Technologies (Malaysia) Sdn Bhd; KiongKay Ng, INFINEON TECHNOLOGIES; Mr. HoonYen Gwee, INFINEON TECHNOLOGIES
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