WLCSP Laminate Removal using NIR laser
WLCSP Laminate Removal using NIR laser
Wednesday, October 31, 2018: 8:00 AM
226BC (Phoenix Convention Center)
Summary:
This paper outline the backside laminate removal method of WLCSP using the near infrared (NIR) laser that produces laser energy in the 1,064 nm range. This method significantly reduce the sample preparation time and also reduce the risk of mechanical damage as no application of mechanical force. This method works effectively for the WLCSP that mounted on PCB board.
This paper outline the backside laminate removal method of WLCSP using the near infrared (NIR) laser that produces laser energy in the 1,064 nm range. This method significantly reduce the sample preparation time and also reduce the risk of mechanical damage as no application of mechanical force. This method works effectively for the WLCSP that mounted on PCB board.