Sample Preparation and Device Deprocessing I

Wednesday, October 31, 2018: 8:00 AM-9:40 AM
226BC (Phoenix Convention Center)
Mr. Hueihao Yap, Globalfoundries and Mr. Ryan Fredrickson, On Semiconductor
8:00 AM
WLCSP Laminate Removal using NIR laser
Mr. CHUN HAUR KHOO, ON Semiconductor
8:25 AM
An Innovative Method to Enhance the Process of Front-Side Lapping for Advanced Packages
Mr. Sze Yee Tan, Infineon Technologies (Malaysia) Sdn. Bhd.; Ms. Chea Wee Lo, Infineon Technologies (Malaysia) Sdn Bhd
8:50 AM
Gallium Arsenide (GaAs) Integrated Circuits Decapsulation Technique Using Mixed Acid Chemistry for Die-Level Failure Analysis
Mr. Harold Jeffrey Consigo, MSECE, Analog Devices Inc.; Mr. Ricardo Calanog, Analog Devices General Trias (ADGT); Ms. Melissa Caseria, Analog Devices General Trias (ADGT)
9:15 AM
Special sample preparation methodology for Cu pillar bump characterization on Advance Thin Small Leadless (ATSLP) Flip Chip with Copper Pillar (CuP) Bump Interconnect technology
Mr. hoonyen gwee, Infineon Technologies
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