Integration of Probing Capability into Plasma FIB for In-Situ Delayering, Defect Inspection, and EBAC on BEOL Defects of sub-20nm FINFET Devices

Thursday, November 1, 2018: 8:00 AM
226BC (Phoenix Convention Center)
Mr. Dionaldo Zudhistira , Advanced Micro Devices (S) Pte Ltd, Singapore, Singapore
Maozhe Samuel Wei , Advanced Micro Devices (S) Pte Ltd, Singapore, Singapore
V. Narang , Advanced Micro Devices (S) Pte Ltd, Singapore, Singapore
J.M. Chin , Advanced Micro Devices (S) Pte Ltd, Singapore, Singapore
S Sharang , TESCAN Brno s.r.o., Brno, Czech Republic
Mr. Marek Sikula , TESCAN Brno s.r.o., Brno, Czech Republic
Karel Novotny , TESCAN Brno s.r.o., Brno, Czech Republic
Dr. G. Goupil , TESCAN Brno s.r.o., Brno, Czech Republic
Dr. Jozef Vincenc Obona , TESCAN Brno s.r.o., Brno, Czech Republic
Andreas Rummel , Kleindiek Nanotechnik, Reutlingen, Germany
Dr. Matthias Kemmler , Kleindiek Nanotechnik, Reutlingen, Germany
Dr. Stephan Kleindiek , Kleindiek Nanotechnik, Reutlingen, Germany

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