Thursday, November 1, 2018: 8:00 AM-9:40 AM
226BC (Phoenix Convention Center)
Mr. Antonio Tollis, Analog Devices and Dr. Bryan Tracy, PhD, EAG Laboratories
8:00 AM
Integration of Probing Capability into Plasma FIB for In-Situ Delayering, Defect Inspection, and EBAC on BEOL Defects of sub-20nm FINFET Devices
Mr. Dionaldo Zudhistira, Advanced Micro Devices (S) Pte Ltd;
Maozhe Samuel Wei, Advanced Micro Devices (S) Pte Ltd;
V. Narang, Advanced Micro Devices (S) Pte Ltd;
J.M. Chin, Advanced Micro Devices (S) Pte Ltd;
S Sharang, TESCAN Brno s.r.o.;
Mr. Marek Sikula, TESCAN Brno s.r.o.;
Karel Novotny, TESCAN Brno s.r.o.;
Dr. G. Goupil, TESCAN Brno s.r.o.;
Dr. Jozef Vincenc Obona, TESCAN Brno s.r.o.;
Andreas Rummel, Kleindiek Nanotechnik;
Dr. Matthias Kemmler, Kleindiek Nanotechnik;
Dr. Stephan Kleindiek, Kleindiek Nanotechnik
8:25 AM
Transmission Electron Microscopy Sample Preparation By Design Based Recipe Writing in a DBFIB
Dr. James J. Demarest, IBM;
Mr. Brad Austin, IBM;
Jason Arjavac, ThermoFisher;
Mary Breton, IBM;
Mr. Marc Bergendahl, IBM;
Mark Biedrzycki, ThermoFisher;
Ms. Carol Boye, IBM;
Dr. John Gaudiello, IBM;
Jack Hager, ThermoFisher;
Shravan Matham, IBM;
Khanh Nguyen, ThermoFisher;
Martin Persala, ThermoFisher;
Dr. Sean Teehan, IBM
8:50 AM
Low-energy Ar ion milling of FIB TEM specimens from 14 nm and future FinFET technologies
Dr. Cecile S. Bonifacio, E.A. Fischione Instruments, Inc.;
Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.;
Dr. Michael J. Campin, E.A. Fischione Instruments, Inc.;
Ms. Mary Ray, E.A. Fischione Instruments, Inc.;
Mr. Paul Fischione, E.A. Fischione Instruments, Inc.
