Improved Phase Data Acquisition for Thermal Emissions Analysis of 2.5D IC

Tuesday, October 30, 2018: 2:15 PM
226BC (Phoenix Convention Center)
Ms. Bernice Zee , Advanced Micro Devices (AMD), Singapore, Singapore
Ms. Wen Qiu , Advanced Micro Devices, Singapore, Singapore
Brian Lai , Thermo Fisher Scientific, Fremont, CA
David Tien , Thermo Fisher Scientific, Fremont, CA
Jim Vickers , Thermo Fisher Scientific, Fremont, CA

See more of: 3D Device Failure Analysis
See more of: Technical Program