44th International Symposium for Testing and Failure Analysis (Oct. 28 - Nov. 1, 2018)
October 28 - November 01, 2018
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Improved Phase Data Acquisition for Thermal Emissions Analysis of 2.5D IC
Tuesday, October 30, 2018: 2:15 PM
226BC (Phoenix Convention Center)
Ms. Bernice Zee
,
Advanced Micro Devices (AMD), Singapore, Singapore
Ms. Wen Qiu
,
Advanced Micro Devices, Singapore, Singapore
Brian Lai
,
Thermo Fisher Scientific, Fremont, CA
David Tien
,
Thermo Fisher Scientific, Fremont, CA
Jim Vickers
,
Thermo Fisher Scientific, Fremont, CA
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3D Device Failure Analysis
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