3D Device Failure Analysis
Tuesday, October 30, 2018: 1:00 PM-3:05 PM
226BC (Phoenix Convention Center)
Dr. Jesse Alton, TeraView Limited and Dr. Christian Schmidt, Nvidia
1:00 PM
Challenges in Failure Analysis of 3D Bonded Wafers
Mr. Pradip Sairam Pichumani, GLOBALFOUNDRIES;
Ms. Tanya Atanasova, GLOBALFOUNDRIES;
Dr. Frieder Baumann, GLOBALFOUNDRIES Inc.;
Dr. Michael Hatzistergos, GLOBALFOUNDRIES Inc.;
Dr. Jay Mody, GLOBALFOUNDRIES Inc.;
Mr. Steven Molis, GLOBALFOUNDRIES Inc.;
Mr. Scott Pozder, GLOBALFOUNDRIES;
Dr. Anita Madan, GLOBALFOUNDRIES
1:25 PM
Detection of local Cu-to-Cu bonding defects in wafer-to-wafer hybrid bonding using GHz-SAM.
Prof. Ingrid De Wolf, KU Leuven;
Mr. Ahmad Khaled, KU Leuven;
Dr. Soon-Wook Kim, IMEC;
Dr. Eric Beyne, IMEC;
Mr. Michael Kögel, Fraunhofer Institute for Microstructure of Materials and Systems IMWS;
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS;
Dr. Tatjana Djuric, PVA Tepla Analytical Systems GmbH;
Ingo Wiesler, PVA Tepla Analytical Systems GmbH
