Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS
Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS
Monday, October 29, 2018: 4:15 PM
225AB (Phoenix Convention Center)
Summary:
The results presented show the microstructrual analysis of solder joints using EBSD (in combination with EDS). This enables the effective characterisation of the key microstructural parameters of the joints and provides an accurate assessment of the quality of intact bonds. Regions of strain localisation that are not apparent from the Sn and Pb phase distribution can be rapidly identified, providing key insights into the mechanism of bond failure.
The results presented show the microstructrual analysis of solder joints using EBSD (in combination with EDS). This enables the effective characterisation of the key microstructural parameters of the joints and provides an accurate assessment of the quality of intact bonds. Regions of strain localisation that are not apparent from the Sn and Pb phase distribution can be rapidly identified, providing key insights into the mechanism of bond failure.