Board and System Level FA

Monday, October 29, 2018: 3:25 PM-4:40 PM
225AB (Phoenix Convention Center)
Ms. Becky Holdford, Texas Instruments and Mr. Jason Wheeler, Raytheon
3:25 PM
Power Device Burned Completely – And Now, How to Find the Root Cause?
Prof. Peter Jacob, EMPA Duebendorf (50%, 1993-today, Main Affiliation)
3:50 PM
Non-Destructive 3D Failure Analysis Workflow for Electrical Failure Analysis in Complex 2.5D-Based Devices Combining 3D Magnetic Field Imaging and 3D X-Ray Microscopy
Dr. Antonio Orozco, Neocera, LLC; Ms. Elena Talanova, Neocera, LLC; Mr. Alex Jeffers, Neocera, LLC; Ms. Florencia Rusli, Neocera, LLC; Ms. Bernice Zee, Advanced Micro Devices (AMD); Ms. Wen Qiu, Advanced Micro Devices (AMD); Syahirah MD Zulkifli, Advanced Micro Devices (AMD); Dr. Allen Gu, ZEISS SMT Process Control Solutions; Mr. Juan Atkinson Mora, ZEISS SMT Process Control Solutions
4:15 PM
Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS
Dr. John Lindsay, Oxford Instruments NanoAnalysis; Dr. Pat Trimby, Oxford Instruments NanoAnalysis; Dr. Jenny Goulden, Oxford Instruments NanoAnalysis; Stewart McCracken, MCS Ltd; Richard Andrews, MCS Ltd
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