Board and System Level FA
Monday, October 29, 2018: 3:25 PM-4:40 PM
225AB (Phoenix Convention Center)
Ms. Becky Holdford, Texas Instruments and Mr. Jason Wheeler, Raytheon
3:50 PM
Non-Destructive 3D Failure Analysis Workflow for Electrical Failure Analysis in Complex 2.5D-Based Devices Combining 3D Magnetic Field Imaging and 3D X-Ray Microscopy
Dr. Antonio Orozco, Neocera, LLC;
Ms. Elena Talanova, Neocera, LLC;
Mr. Alex Jeffers, Neocera, LLC;
Ms. Florencia Rusli, Neocera, LLC;
Ms. Bernice Zee, Advanced Micro Devices (AMD);
Ms. Wen Qiu, Advanced Micro Devices (AMD);
Syahirah MD Zulkifli, Advanced Micro Devices (AMD);
Dr. Allen Gu, ZEISS SMT Process Control Solutions;
Mr. Juan Atkinson Mora, ZEISS SMT Process Control Solutions
