Correlation if Thermal Rise Time to Sample Depth in Multi-Die Stacked Packages

Tuesday, October 30, 2018: 2:40 PM
226BC (Phoenix Convention Center)
Mr. M. Shi , Huawei Technologies Co, Ltd, Bantian, Shenzhen, China
Mr. Alan G. Street , Huawei Technologies Co, Ltd, Bantian, Shenzhen, China
Mr. Y. F. Dai , Huawei Technologies Co, Ltd, Bantian, Shenzhen, China
Ms. Zezhong Fu , Futurewei Technology, Inc., Chandler, AZ

Summary:

A set of calibration samples are prepared and characterised to provide data correlating the Z-depth of a thermal source to the thermal rise time and phase delay of a lock-in thermography signal.
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