Challenges in Failure Analysis of 3D Bonded Wafers

Tuesday, October 30, 2018: 1:00 PM
226BC (Phoenix Convention Center)
Mr. Pradip Sairam Pichumani , GLOBALFOUNDRIES, Malta, NY
Ms. Tanya Atanasova , GLOBALFOUNDRIES, Malta, NY
Dr. Frieder Baumann , GLOBALFOUNDRIES Inc., Malta, NY
Dr. Michael Hatzistergos , GLOBALFOUNDRIES Inc., Malta, NY
Dr. Jay Mody , GLOBALFOUNDRIES Inc., Malta, NY
Mr. Steven Molis , GLOBALFOUNDRIES Inc., Fishkill, NY
Mr. Scott Pozder , GLOBALFOUNDRIES, Malta, NY
Dr. Anita Madan , GLOBALFOUNDRIES, Malta, NY

See more of: 3D Device Failure Analysis
See more of: Technical Program