Nanoscale 3D X-Ray Microscopy for high density Multi-Chip Packaging FA
Nanoscale 3D X-Ray Microscopy for high density Multi-Chip Packaging FA
Thursday, November 1, 2018: 10:40 AM
226BC (Phoenix Convention Center)
Summary:
Advanced Packaging technologies have brought novel high density Multi-Chip architectures and a parallel effort to silicon scaling. As a side effect, integration and failure analysis fields are constantly facing new challenges in imaging weak spots and defects buried within the complex build up. 3D X-Ray Microscopy (XRM) has been a key method for non-destructive analysis but starts to face physical limitations in spatial resolution. This paper will demonstrate the use of a next generation XRM (X-ray Microscopy) method beneficial for such complex structures. Using a test vehicle for 3D device packaging, a sample preparation workflow is demonstrated that prepares the region of interest for nanoscale 3D XRM acquisition.
Advanced Packaging technologies have brought novel high density Multi-Chip architectures and a parallel effort to silicon scaling. As a side effect, integration and failure analysis fields are constantly facing new challenges in imaging weak spots and defects buried within the complex build up. 3D X-Ray Microscopy (XRM) has been a key method for non-destructive analysis but starts to face physical limitations in spatial resolution. This paper will demonstrate the use of a next generation XRM (X-ray Microscopy) method beneficial for such complex structures. Using a test vehicle for 3D device packaging, a sample preparation workflow is demonstrated that prepares the region of interest for nanoscale 3D XRM acquisition.