Packaging & Assembly Level FA

Thursday, November 1, 2018: 9:50 AM-11:30 AM
226BC (Phoenix Convention Center)
Ms. Kannu Wadhwa, Carl Zeiss and Dr. Peng Li, Intel Corp.
9:50 AM
The Investigation of Fluorine Induced Novel Probe Marker Discoloration
Dr. Wen-Fei Hsieh, Ardentec Corporation
10:15 AM
Effective method for analyzing IGBT leakage failures related to the exposed junction on the die sidewall
Ms. Chi Thi My Dang, On Semiconductor Vietnam
10:40 AM
Nanoscale 3D X-Ray Microscopy for high density Multi-Chip Packaging FA
Dr. Christian Schmidt, Carl Zeiss X-Ray Microscopy, Inc.; Ms. Cheryl Hartfield, Carl Zeiss X-Ray Microscopy, Inc.; Dr. Stephen T. Kelly, Carl Zeiss X-Ray Microscopy, Inc.; Mr. Luke England, Globalfoundries; Mr. Sukeshwar Kannan, Globalfoundries
11:05 AM
Investigation of Die Tilting of Packages with Single and Multi-chips
Ms. Chea Wee Lo, Infineon Technologies (Malaysia) Sdn Bhd
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