Fault Isolation

Sunday, November 10, 2019: 8:00 AM-2:00 PM
F 151 (Oregon Convention Center)
Dr. Mayue Xie, Intel and Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
8:00 AM
Defect Localization by Lock-In-Thermography
Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
9:00 AM
Photonic Localization Techniques
Prof. Christian Boit, Technische Universitaet Berlin
10:00 AM
Morning Refreshment Break
10:20 AM
LADA and SDL: Powerful Techniques for Marginal Failures
Mr. Dan Bodoh, NXP Semiconductors; Mr. Kent Erington, NXP Semiconductors
11:50 AM
Lunch
12:30 PM
FA Technique Selection for Front End Defect Localization in Bulk Semiconductor (Si) FA
Mr. Gregory Johnson, Carl Zeiss SMT, Inc.
See more of: Tutorial
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