Sample Preparation and Device Deprocessing - POSTERS

Wednesday, November 13, 2019: 2:30 PM-4:30 PM
Exhibit Hall D (Oregon Convention Center)
Sample Preparation and Device Deprocessing - POSTERS Dr. Changqing Chen, Globalfoundries Singapore and Mr. P. K. Tan, GLOBALFOUNDRIES Singapore Pte. Ltd.
Ultra-thinning of silicon for backside fault isolation
Dr. Michael J. Campin, E.A. Fischione Instruments, Inc.; Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.
Transmission Electron Microscopy Sample Preparation By Design Based Recipe Writing in a DBFIB Part 2
Dr. James J. Demarest, IBM; Mr. Brad Austin, IBM; Jason Arjavac, FEI Company; Mary Breton, ThermoFisher; Mr. Marc Bergendahl, IBM; Mark Biedrzycki, Thermo Fisher Scientific; Dr. Carol Boye, IBM; Dr. Tenzile Berkin Cilingiroglu, Thermo Fisher Scientific; Dr. John Gaudiello, IBM; Jack Hager, ThermoFisher; Shravan Matham, IBM; Khanh Nguyen, ThermoFisher; Martin Persala, ThermoFisher; Dr. Michael Rizzolo, IBM; Mr. Subhei Shaar, ThermoFisher; Dr. Sean Teehan, IBM
Targeted Silicon Ultra-thinning by Contour Milling for Advanced Fault Isolation
Mr. Wee Siang Teo, Nanyang Technological University; Maozhe Samuel Wei, Advanced Micro Devices (S) Pte Ltd; V. Narang, Advanced Micro Devices (S) Pte Ltd; Prof. Chee Lip GAN, Nanyang Technological University; Mr. Chris Richardson, Allied High Tech Products, Inc.; Mr. Gary Liechty, Allied High Tech Products, Inc.
See more of: Technical Program
<< Previous Session | Next Session >>