System on Package User Group

Monday, November 11, 2019: 12:00 PM-2:00 PM
E 145/146 (Oregon Convention Center)
System-on-Package (SOP) an emerging microelectronics technology that challenges designers, foundries and OSATs alike to integrate various functional components and modules in one small package. It covers variety of packaging technologies (WLP, Flip-Chip, PoP, FO, 2.5D and 3D) and performs most of the functions of an electronic system.  Click HERE to visit the website for additional information. Dr. Lihong Cao, Advanced Micro Devices and Prasad Divekar, Intel Corporation
See more of: Technical Program