Sample Prep and Device Deprocessing

Tuesday, December 8, 2020: 3:25 PM-4:40 PM
Dr. Erwin Hendarto, Silicon Labs and Dr. Chuan Zhang, NVIDIA
3:25 PM
Laser Chemical Etching Trench Refinements for Backside Debug Journey to the Circuit Layer
Mr. Matthew M. Mulholland, Intel Corporation; Dr. Shida Tan, Intel Corporation; Muhammad Usman Raza, Intel Corporation; Dr. Robert D. Chivas, Varioscale; Mr. Scott Silverman, Varioscale; Dr. Michael DiBattista, Varioscale; Matthew Levesque, Varioscale; Dr. Christopher G.L. Ferri, Varioscale; Jordan Furlong, Varioscale
3:50 PM
Cross sectional passive voltage contrast approach for gate oxide breakdown defect isolation and visualization for TEM analysis
Dr. S. L. Ting, Globalfoundries Singapore Pte Ltd.; Mr. P. K. Tan, Globalfoundries Singapore Pte Ltd.; Dr. Y. L. Pan, Globalfoundries Singapore Pte Ltd.; Ms. H. H. W. Thoungh, Globalfoundries Singapore Pte Ltd.; Ms. S.Y Thum, Globalfoundries Singapore Pte Ltd.; Mr. F. Rivai, Globalfoundries Singapore Pte Ltd.; Mr. P.T. Ng, Globalfoundries Singapore Pte Ltd.; Dr. S. J. Moon, Globalfoundries Singapore Pte Ltd.; Mr. D. Nagalingam, Globalfoundries Singapore Pte Ltd.; Ms. T.T. Yu, Globalfoundries Singapore Pte Ltd.; Ms. S.P. Neo, Globalfoundries Singapore Pte Ltd.; Dr. C. Q. Chen, Globalfoundries Singapore Pte Ltd.
4:15 PM
A Novel Deprocessing Technique for Revealing Transistor-level Damage on 7nm FinFET Devices
Mr. Fei Long Xu, Xilinx, Inc.; Mr. Phoumra Tan, Xilinx, Inc
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