(V) Quantitative evaluation of bonded silicon wafer by Scanning Acoustic Tomography

Monday, November 1, 2021: 4:05 PM

104 AB (Phoenix Convention Center)

Mr. Koutaro Kikukawa , Hitachi Power Solutions Co., Ltd., Hitachinaka, Ibaraki, Japan

Mr. Natsuki Sugaya , Hitachi Power Solutions Co., Ltd., Hitachinaka, Ibaraki, Japan

Mr. Yoshihiro Tomita , Intel K.K., Chiyoda, Tokyo, Japan

Dr. Shigeru Ohno , Hitachi Power Solutions Co., Ltd., Hitachinaka, Ibaraki, Japan

See more of: SiP and 3D Devices
See more of: Technical Program