SiP and 3D Devices

Monday, November 1, 2021: 3:00 PM-4:30 PM
104 AB (Phoenix Convention Center)
* 3D defect localization
* High throughput site specific sample prep
* TSV and ยต bump failure modes
* 3D stacking failure modes / thermo-mech. Issues
Prof. Ingrid De Wolf, imec and Ms. Kannu Wadhwa, ZEISS
3:00 PM
(V) INVITED: Back-side Power Delivery Network: Innovative scaling booster for 3D heterogeneous integration
Dr. Anne Jourdain, Imec; Dr. Kristof J.P. Jacobs, imec; Dr. Michele Stucchi, imec
3:40 PM
(V) Fault isolation approaches for nanoscale TSV interconnects in 3D heterogenous integration
Dr. Kristof J.P. Jacobs, imec; Dr. Anne Jourdain, Imec; Prof. Ingrid De Wolf, imec; Dr. Eric Beyne, Imec
4:05 PM
(V) Quantitative evaluation of bonded silicon wafer by Scanning Acoustic Tomography
Mr. Koutaro Kikukawa, Hitachi Power Solutions Co., Ltd.; Mr. Natsuki Sugaya, Hitachi Power Solutions Co., Ltd.; Mr. Yoshihiro Tomita, Intel K.K.; Dr. Shigeru Ohno, Hitachi Power Solutions Co., Ltd.
See more of: Technical Program
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