(V) Fault isolation approaches for nanoscale TSV interconnects in 3D heterogenous integration

Monday, November 1, 2021: 3:40 PM

104 AB (Phoenix Convention Center)

Dr. Kristof J.P. Jacobs , imec, Leuven, Belgium

Dr. Anne Jourdain , Imec, Leuven, Belgium

Prof. Ingrid De Wolf , imec, Leuven, Belgium

Dr. Eric Beyne , Imec, Leuven, Belgium

See more of: SiP and 3D Devices
See more of: Technical Program