(V) SAMPLE PREPARATION AND DEVICE DEPROCESSING: Practical methodologies in Restoring Initial failure mode and Backside Focused Ion Beam Cross-section for Defect Visualization
(V) SAMPLE PREPARATION AND DEVICE DEPROCESSING: Practical methodologies in Restoring Initial failure mode and Backside Focused Ion Beam Cross-section for Defect Visualization
Wednesday, November 3, 2021
West Hall 1-2 (Phoenix Convention Center)
Summary:
In this paper, a case study of a CMOS Image Sensor is presented wherein the failure mode recovered which was restored and how the structural limitations are overcome for fault isolation on both front- and back-side. A modified process flow was performed to visualize the defect through backside Focused Ion Beam (FIB) cross-section.
In this paper, a case study of a CMOS Image Sensor is presented wherein the failure mode recovered which was restored and how the structural limitations are overcome for fault isolation on both front- and back-side. A modified process flow was performed to visualize the defect through backside Focused Ion Beam (FIB) cross-section.