Poster Session

Wednesday, November 3, 2021: 1:05 PM-3:05 PM
West Hall 1-2 (Phoenix Convention Center)
PRODUCT YIELD, TEST & DIAGNOSTICS: Quantile Based Statistical Failure Analysis for Wafer Level Test Comparison
Mr. Jeongwon Bae, Samsung Electronics; Mr. Minjoo Kim, Samsung Electronics; Mr. Jongbum Lee, Samsung Electronics; Mr. Myunghoon Oak, Samsung Electronics; Mr. Choongsun Park, Samsung Electronics; Mr. Sunghun Park, Samsung Electronics; Dr. Sungsoo Yim, Samsung Electronics; Mr. Heeil Hong, Samsung Electronics; Mr. Jooyoung Lee, Samsung Electronics
DIE LEVEL FAULT ISOLATION: Creative approaches for thermal hot spot identification on analog IC
Mr. Chunhaur Khoo, ON Semiconductor; Mr. Zhi Jie Lau, ON Semiconductor; Mr. Kuang Shien Lee, ON Semiconductor
MICROSCOPY AND MATERIAL CHARACTERIZATION: Automated Metrology of verticality of Cross-sectioned channel hole at V-NAND with over 200 layers by Transmission Electron microscope
Mr. Dong-yeob KIM, Thermofisher Scientific Korea; Dr. Jong-ick Son, Thermofisher Scientific Korea; Dr. Christopher H. Kang, Thermofisher Scientific Korea
(V) SCANNING PROBE ANALYSIS: Non-visual defect identification by dopant analysis method in FinFET devices
Mr. Seungjun Son, Samsung Austin Semiconductor, LLC; Mr. Christopher Penley, Samsung Austin Semiconductor, LLC; Mr. Jeffrey Hurst, Samsung Austin Semiconductor, LLC; Mr. Christopher Michon, Samsung Austin Semiconductor, LLC; Dr. Yong Guo, Samsung Austin Semiconductor, LLC; Mr. Rafael Lainez, Samsung Austin Semiconductor, LLC; Dr. Jason Reifsnider, Samsung Austin Semiconductor, LLC
(V) DIE LEVEL FAULT ISOLATION: Electro-Optical Probing for Capturing Fast-to-Rise Scan Chain Failures
Mr. Karl Villareal, ON Semiconductor BVBA; Mr. Rommel Estores, ON Semiconductor
CASE STUDIES: FA PROCESSES - FA Approach in MIM (Metal-Insulator-Metal) Capacitor Failures
Mr. Kuang Shien Lee, ON Semiconductor; Regina Kuan, ON Semiconductor
EMERGING FA TECHNIQUES AND CONCEPTS: Pairing Laser Ablation and Xe Plasma FIB-SEM: An approach for precise end-pointing in large-scale Physical Failure Analysis in the Semiconductor Industry
Mr. Rodrigo Delgadillo-Blando, TESCAN ORSAY HOLDING a.s.; Mr. Lukáš Hladík, TESCAN ORSAY HOLDING a.s.; Mr. Jozef Vincenc Oboňa, TESCAN ORSAY HOLDING a.s.; Mr. Tomáš Borůvka, TESCAN Brno s.r.o.; Mr. Martin Búran, TESCAN Brno s.r.o.; Michael Krause, Fraunhofer Institute for Mechanics of Materials; Mr. Boris Arnold Rottwinkel, Laser Zentrum Hannover e.V.; Mr. Scott E. Fuller, TESCAN USA
(V) CASE STUDIES: FA PROCESSES - Commonality analysis for multiple chain integrity failures
Mr. Angelo Antonio Merassi, STMicroelectronics; Mr. Matteo Medda, STMicroelectronics
(V) SAMPLE PREPARATION AND DEVICE DEPROCESSING: Chip Recombination Method in Planar Deprocessing - A Solution for Failure Analysis on Chip Edge Defects
Mr. Kah Chin Cheong, Samsung Austin Semiconductor, LLC; Mr. Gabriel Pragay, Samsung Austin Semiconductor, LLC; Mrs. Wiwy Wudjud, Samsung Austin Semiconductor, LLC; Mr. Rafael Lainez, Samsung Austin Semiconductor, LLC
(V) SAMPLE PREPARATION AND DEVICE DEPROCESSING: Fast and Effective Sample Preparation Technique for Backside Fault Isolation on GaN packaged devices
Mr. Tony Colpaert, ON SEMICONDUCTOR; Mr. Stefaan Verleye, ON Semiconductor
(V) SAMPLE PREPARATION AND DEVICE DEPROCESSING: Practical methodologies in Restoring Initial failure mode and Backside Focused Ion Beam Cross-section for Defect Visualization
Mrs. Alvina Jean Tampos, ON Semiconductor BVBA; Mr. Karl Villareal, ON Semiconductor BVBA
(V) PRODUCT YIELD, TEST & DIAGNOSTICS: Universal Application of Load Board (L/B) and Socket with Direct Current Tester (DCT) for Various Packages
Mr. Yi-Sheng Lin, Advanced Semiconductor Engineering Corporation
PRODUCT YIELD, TEST & DIAGNOSTICS: Electrical Screening Method of VNAND Flash Channel Hole Bending Defects
Mr. Dooyeun Jung, samsung electronics; Dr. Youngha Choi, samsung electronics; Mr. Jae In Lee, samsung electronics; Mr. Bu-il Nam, samsung electronics; Dr. Ki-Young Dong, samsung electronics; Mr. Bohchang Kim, samsung electronics; Mrs. Eunkyoung Kim, samsung electronics; Dr. Ki-Whan Song, samsung electronics; Dr. Jai Hyuk Song, samsung electronics; Prof. Myungsuk Kim, Kyungpook National University; Prof. Woo Young Choi, Sogang University
(V) PRODUCT YIELD, TEST & DIAGNOSTICS: Advanced Soft Defect Screen Methodology for Nano-scale SRAM Yield Improvement
Mr. Pangyum KIM, Samsung Electronics Co. Ltd
CASE STUDIES: DEVICE ANALYSIS - SCM Application and Failure Analysis Procedure for Ion-implantation Issues in Power Devices
Mr. Kuang-Tse Ho, Materials Analysis Technology; Dr. Cheng-Che Li, Materials Analysis Technology
CASE STUDIES - DEVICE ANALYSIS: Failure Case Studies of Oxide-confined VCSELs
Mr. Kuang-Tse Ho, Materials Analysis Technology; Dr. Ching-Hsiang Chan, Materials Analysis Technology
(V) CASE STUDIES - DEVICE ANALYSIS: SRAM Bitcell Defect Identification Methodology using Electrical Failure Analysis Data
Dr. Hyungtae Kim, Samsung Electronics; Mr. Geonho Kim, Samsung Electronics
NANOPROBING, ELECTRICAL CHARACTERIZATION: P-N Junction Analysis using Electron Beam Induced Current (EBIC) Technique
Ms. Lori Sarnecki, ON Semiconductor; Regina Kuan, ON Semiconductor; Mr. Kuang Shien Lee, ON Semiconductor
FIB SAMPLE PREPARATION: Automated cell layer counting and marking at target layer of 3D NAND TEM samples by Focused Ion Beam
Mrs. Jisu Ryu, Thermo Fisher Scientific; Mr. Jaeheum Baek, SK Hynix Semiconductor. Inc; Mrs. Seojin Kim, Thermo Fisher Scientific; Dr. Christopher H. Kang, Thermo Fisher Scientific
FIB SAMPLE PREPARATION: Enabling Automated Sample Delayering, Imaging, and Probing Prep with an Adaptive Endpointing Workflow
Mr. Sean Morgan Jones, Thermo Scientific; Mr. Peter Carleson, FEI Company; Mr. Mark Najarian, ThermoFisher Scientific; Dr. Gavin A Mitchson, Ph.D., Thermo Fisher Scientific; Ms. Sophia Weeks, Thermo Fisher Scientific; Mr. Noel Franco, Thermo Fisher Scientific; Surendra Mandala, ThermoFisher Scientific
FIB SAMPLE PREPARATION: A New Delayering Application Workflow in Advanced 5nm Technology Device with Xenon Plasma Focus Ion Beam Microscopy
Mrs. hayoung choi, Thermo Fisher Scentific
FIB SAMPLE PREPARATION: Workflow solution for depth resolved 3D NAND critical dimension metrology
Mr. Mark Najarian, ThermoFisher Scientific
SiP AND 3D DEVICES: Accelerate Your 3D X-Ray Failure Analysis by Deep Learning High Resolution Reconstruction
Dr. Allen Gu, Carl Zeiss Microscopy; Dr. Andriy Andreyev, Carl Zeiss Microscopy; Ms. Masako Terada, Carl Zeiss Microscopy; Ms. Bernice Zee, Advanced Micro Devices (AMD); Mrs. Syahirah MD Zulkifli, Advanced Micro Devices (AMD); Ms. Yanjing Yang, ZEISS Research Microscopy Solutions
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