(V) Analysis of time-resolved thermal responses in Lock-In thermography by independent component analysis (ICA) for a 3D-spatial separation of weak thermal sources and defects

Tuesday, November 2, 2021: 11:00 AM
104 ABC (Phoenix Convention Center)
Mr. Michael Kögel , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Dr. Sebastian Brand , Fraunhofer Institute for Microstructure of Materials and Systems, Halle, Germany
Mr. Christian Große , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Dr. Kristof J.P. Jacobs , imec, Leuven, Belgium
Prof. Ingrid De Wolf , imec, Leuven, Belgium
Mr. Frank Altmann , Fraunhofer Institute for Microstructure of Materials and Systems, Halle, Germany

Summary:

The application of an ICA based analysis method appears highly promising for separating mixtures of signal components originated at individual thermal sources and benefits towards the aim of a highly precise lateral and axial localization of defect-related thermal spots in 3D microelectronic devices.
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