AI Applications for FA I

Tuesday, November 2, 2021: 10:10 AM-11:50 AM
104 ABC (Phoenix Convention Center)
* Image recognition for defect and end point detection
* Signal analysis for defect signature detection
* Data correlation and FA date bases
Mr. Pascal Gounet, STMicroelectronics and Dr. Joy Liao, nVIDIA Corporation
10:10 AM
(V) INVITED: AI Techniques for Fault Analysis
Dr. Konstantin Schekotihin, Universität Klagenfurt
10:35 AM
(V) Report Classification for Semiconductor Failure Analysis
Ms. Anna Safont-Andreu, Infineon Tech. Austria AG; Mr. Christian Burmer, Infineon tech. AG; Dr. Konstantin Schekotihin, Universität Klagenfurt
11:00 AM
(V) Analysis of time-resolved thermal responses in Lock-In thermography by independent component analysis (ICA) for a 3D-spatial separation of weak thermal sources and defects
Mr. Michael Kögel, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Dr. Sebastian Brand, Fraunhofer Institute for Microstructure of Materials and Systems; Mr. Christian Große, Fraunhofer Institute for Microstructure of Materials and Systems IMWS; Dr. Kristof J.P. Jacobs, imec; Prof. Ingrid De Wolf, imec; Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems
11:25 AM
(V) Logo Classification and Data Augmentation Techniques for PCB Assurance and Counterfeit Detection
Mr. Mukhil Azhagan Mallaiyan Sathiaseelan, University of Florida; Ms. Olivia P. Paradis, University of Florida; Mr. Rajat Rai, University of Florida; Mr. SuryaPrakash Vasudev Pandurangi, University of Florida; Mr. Manoj Yasaswi Vutukuru, University of Florida; Dr. Shayan Taheri, University of Florida; Dr. Navid Asadizanjani, University of Florida
See more of: Technical Program
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