(V) DIE LEVEL FAULT ISOLATION: Electro-Optical Probing for Capturing Fast-to-Rise Scan Chain Failures

Wednesday, November 3, 2021
West Hall 1-2 (Phoenix Convention Center)
Mr. Karl Villareal , ON Semiconductor BVBA, Oudenaarde, Belgium
Mr. Rommel Estores , ON Semiconductor, Oudenaarde, Belgium

Summary:

Electro Optical Probing was shown in this paper as an effective tool for finding failures in fast-to-rise scan chain analysis. . Instead of relying on destructive methods to verify if the scan cells are failing, it lessens the analysis time by identifying the suspect ROI before PFA.
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