(V) Pushing Failure Mode Stimulus to Overcome the Limitation/Boundaries of Soft Defect Localization Tools

Monday, November 1, 2021: 3:50 PM
105 AB (Phoenix Convention Center)
Mr. Allan Norico , ON Semiconductor, Oudenaarde, Belgium
Mr. Rommel Estores , ON Semiconductor, Oudenaarde, Belgium

Summary:

Temperature dependent failures are one of the most challenging cases that will be encountered by the analyst. Soft Defect Localization (SDL) is a technique used to analyze such temperature-dependent, ‘soft defect’ failures. There are many literatures that discuss this techniques and its different applications. Dynamic Analysis by Laser Stimulation (DALS) is one of the known SDL techniques. However, there are cases where the failure is occurring at a temperature where laser alone is not sufficient to effectively induce a change of behavior. The analyst need to think out of the box by understanding how the device will react on external conditions and to make necessary adjustments in DALS settings. This paper will discuss three cases that presents different challenges and simple yet effective solutions in performing DALS analysis where the failing temperature is too high for the laser to induce from room temperature, cold temperature failure, complex triggering (SPI), and using an internal signal as input for DALS analysis.
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