(V) Backside EBIRCH Defect Localization for Advanced Flip-Chip Failure Analysis
(V) Backside EBIRCH Defect Localization for Advanced Flip-Chip Failure Analysis
Thursday, November 4, 2021: 10:40 AM
105 AB (Phoenix Convention Center)
Summary:
This paper introduced a novel defect localization approach by performing EBIRCH isolation from backside of flip-chips. Sample preparation and probing consideration was discussed, and then case study was used to illustrate how the backside EBIRCH technique provides a powerful solution in capturing and root-causing subtle defects in challenging flip-chip failures.
This paper introduced a novel defect localization approach by performing EBIRCH isolation from backside of flip-chips. Sample preparation and probing consideration was discussed, and then case study was used to illustrate how the backside EBIRCH technique provides a powerful solution in capturing and root-causing subtle defects in challenging flip-chip failures.