Nanoprobing, Electrical Characterization

Thursday, November 4, 2021: 9:50 AM-11:55 AM
105 AB (Phoenix Convention Center)
David Albert, IBM and Mr. John Sanders, Thermofisher
9:50 AM
(V) Resolution of Customer Return Non-Volatile Memory Data Retention Bit Failures Through Bit Map Verification and Bit Cell Characterization by Nanoprobe Analysis
Mr. Randal E. Mulder, Silicon Labs
10:15 AM
Resistive Open Defect Isolation in Nano-probing
Dr. Yunfei Wang, Intel Corporation; Dr. Hyuk Ju Ryu, Intel; Dr. Tom X. Tong, Intel; Mr. Dan Bockelman, Intel
10:40 AM
(V) Backside EBIRCH Defect Localization for Advanced Flip-Chip Failure Analysis
Dr. Chuan Zhang, NVIDIA Corporation; Dr. Jane Y. Li, NVIDIA Corporation; Mr. John Aguada, NVIDIA Corporation; Mr. Howard Marks, NVIDIA Corporation
11:05 AM
EBIRCH localization for low-current soft fails
Mr. Gregory Johnson, ZEISS Microscopy; Andreas Rummel, Kleindiek Nanotechnik
11:30 AM
(V) Pulsing test for defect of resistive word line in dram main cell using WGFMU (Waveform Generator Fast Measurement Unit)
Mr. JaeYun LEE, SK Hynix; Mr. EuiSeok KIM, SK Hynix; N/A JunYeal LIM, SK Hynix; N/A SeokHoon OH, SK Hynix; N/A YoungHa PARK, SK Hynix
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