Dr. Kristof J.P. Jacobs

Research scientist
Imec
Leuven Belgium 3001

Papers:

(V) Fault isolation approaches for nanoscale TSV interconnects in 3D heterogenous integration
(V) Analysis of time-resolved thermal responses in Lock-In thermography by independent component analysis (ICA) for a 3D-spatial separation of weak thermal sources and defects
(V) 3D device/package fault isolation and failure analysis
(V) INVITED: Back-side Power Delivery Network: Innovative scaling booster for 3D heterogeneous integration