47th International Symposium for Testing and Failure Analysis (Oct. 31 - Nov. 4, 2021)
October 31 - November 04, 2021
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Mr. Kuang Shien Lee
Senior FA
ON SEMICONDUCTOR
R&QA
South Portland, ME
USA 04106
Papers:
NANOPROBING, ELECTRICAL CHARACTERIZATION: P-N Junction Analysis using Electron Beam Induced Current (EBIC) Technique
DIE LEVEL FAULT ISOLATION: Creative approaches for thermal hot spot identification on analog IC
CASE STUDIES: FA PROCESSES - FA Approach in MIM (Metal-Insulator-Metal) Capacitor Failures