Packaging and Assembly

Thursday, November 4, 2021: 8:50 AM-9:15 AM

104 ABC (Phoenix Convention Center)

8:50 AM

Underfill delamination and lead-free solder extrusion on an encapsulated chip capacitor during high-temperature life testing
Dr. Jason E. Douglas, Boeing Satellite Systems; Mr. Jeffrey S. Sorbello, Boeing Satellite Systems; Ms. Nicole Carpentier, Boeing Satellite Systems; Mr. Frank Y. Wu, Boeing Satellite Systems

See more of: Technical Program