Monday, October 31, 2022: 2:20 PM-5:10 PM
Ballroom B (Pasadena Convention Center)
| * FIB prep for SEM/TEM |
| * FIB related artefacts |
| * Mulit-ion Source Plasma-FIB |
Mr. Antonio Tollis, Analog Devices and Ms. Valerie Brogden, University of Oregon
3:30 PM
New Approach in Physical Failure Analysis Based on 3D Reconstruction
Dr. Domenico Mello, STMicroelectronics;
Dr. Heiko Stegmann, Carl Zeiss Microscopy GmbH;
Mr. Giuseppe Sciuto, STMicroelectronics;
Mr. Massimiliano Astuto, STMicroelectronics;
Dr. Maria Francesca Santangelo, STMicroelectronics;
Dr. Flavio Cognigni, Sapienza University of Rome, Italy, Sapienza University of Rome, Italy;
Prof. Marco Rossi, Sapienza University of Rome, Italy
3:55 PM
Large field of view and artifact-free plan view TEM specimen preparation by post-FIB Ar milling
Dr. Cecile S. Bonifacio, E.A. Fischione Instruments, Inc.;
Mr. Richard Li, E.A. Fischione Instruments, Inc.;
Dr. Pawel Nowakowski, E.A. Fischione Instruments, Inc.;
Ms. Mary Ray, E.A. Fischione Instruments, Inc.;
Mr. Paul Fischione, E.A. Fischione Instruments, Inc.
