SYSTEM ON PACKAGE USER GROUP
System-on-package (SoP) addresses the demand for complexity and performance by integrating components from different active and passive technologies in one package as shrinking process technology nodes continue to become more cost prohibitive and experience prolonged time to market.
Advanced package types (2.5D, 3D, interposer, WLP, etc.) used in SoP attempt to address the performance demand by shortening critical signal paths and also uniquely enabling integration of different niche technologies. It has a great potential to reduce development overheads and capital costs as well as time to market. However, these great benefits do not come free of cost.
SoP certainly increases reliability risks and failure analysis complexity that many of you are likely encountering. Please join the SoP user group in discussing the difficulties these advanced SoP technologies pose to you and other fellow failure analysts.
Let’s use this opportunity to brainstorm innovative techniques and tools that could tackle the SoP FA complexity.
What features and capabilities do you envision that may help the community improve FA success rate or make a dent in throughput times? What processes work for you? We hope this exchange of ideas will benefit each and every one of the attendees and enrich our FA world!
Topics for System in Package User Group, ISTFA 2022 include the following:
- Fault isolation with CSAM for Fan-out & 2.5D
- Delayering and specifics such as uniformity.
- High speed package delayering with high precision (+/- 5 mm)
- Microwave etching of packages and carbonaceous residues on dies
- Laser ablation for decapsulation