Die Level Fault Isolation
Thursday, November 3, 2022: 2:05 PM-3:45 PM
Ballroom A (Pasadena Convention Center)
| * LVP and LVI |
| * Static and dynamic emission microscopy |
| * Static and dynamic laser stimulation |
| * Thermal Lock-in Thermography |
Mr. Dan Bodoh, NXP Semiconductors and Ms. Lesly Endrinal, QTI Qualcomm
2:30 PM
2GHz Contactless Electron Beam Probing
Mr. Neel Leslie, Thermo Fisher Scientific;
Dr. James S. Vickers, I;
Dr. Blake M. Freeman, Thermo Fisher Scientific;
Dr. Seema Somani, Thermo Fisher Scientific;
Prasad Sabbineni, DCG Systems;
Dr. Praveen Vedagarbha, DCG Systems
2:55 PM
Electrooptical interactions in FinFETs
Dr. Venkat Ravikumar, Advanced Micro Devices - Singapore Pte Ltd;
Mr. Jin Jie, Advanced Micro Devices - Singapore Pte Ltd;
Mr. Vasanth Somasundaram, Advanced Micro Devices - Singapore Pte Ltd;
Dr. Ray J.H. Ng, Institute of High Performance Computing;
Prof. Joel JKW Yang, Singapore University of Technology and Design;
Prof. KL Pey, SIngapore University of Technology and Design
