In-Situ Orthogonal TEM Lamella Conversion for Catching Subtle Defects in 3D Transistors of Microprocessor Devices

Monday, November 13, 2023: 3:00 PM
104 A-B (Phoenix Convention Center)
Mr. Dionaldo Zudhistira , Advanced Micro Devices (S) Pte Ltd, Singapore, Singapore
M.Y. Ho , Advanced Micro Devices - Singapore Pte Ltd, Singapore, Singapore
V. Narang , Advanced Micro Devices (S) Pte Ltd, Singapore, Singapore

See more of: FIB Sample Preparation
See more of: Technical Program