FIB Sample Preparation

Monday, November 13, 2023: 3:00 PM-4:00 PM

104 A-B (Phoenix Convention Center)

Dr. Cathy Vartuli, Butterfly Network and Ms. Valerie Brogden, University of Oregon

3:00 PM

In-Situ Orthogonal TEM Lamella Conversion for Catching Subtle Defects in 3D Transistors of Microprocessor Devices
Mr. Dionaldo Zudhistira, Advanced Micro Devices (S) Pte Ltd; M.Y. Ho, Advanced Micro Devices - Singapore Pte Ltd; V. Narang, Advanced Micro Devices (S) Pte Ltd

3:20 PM

Precise final thinning by concentrated Ar ion beam milling of plan view TEM specimens from phase change memory device prepared in Xe plasma FIB
Dr. Cecile S. Bonifacio, E.A. Fischione Instruments, Inc.; Dr. Yiqi Yu, Carnegie Mellon University; Ms. Mary Ray, E.A. Fischione Instruments, Inc.; Prof. Marek Skowronski, Carnegie Mellon University; Mr. Paul Fischione, E.A. Fischione Instruments, Inc.

3:40 PM

Techniques for Preparation of Damage-Free Ultrathin Cross-Section TEM Samples from Planar TEM Samples
Mr. Jacob Levenson, NXP Semiconductors; Dr. Sam Subramanian, NXP Semiconductors; Mrs. Khiem Ly, NXP Semiconductors; Mr. Tony Chrastecky, NXP Semiconductors

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