In-situ Global Ultra Thinning of Live Chip Backside for Digital Forensic and Failure Analysis

Wednesday, November 15, 2023
Exhibit Hall | West 1 (Phoenix Convention Center)
Mr. Kees Schot , Netherlands Forensic Institution, Den Haag, Netherlands
Ms. Aya Fukami , University of Amsterdam, Amsterdam, Netherlands, Netherlands Forensic Institution, Den Haag, Netherlands

See more of: Exhibitor Dessert Reception, Poster Session and Video Contest
See more of: Technical Program