Exhibitor Dessert Reception, Poster Session and Video Contest

In situ TEM observation of Tungsten migration at elevated temperatures
Mr. Jisung cheon, Samsung Electronics; Ms. Yangsun Park, Samsung Electronics; Mr. Minsik Kim, Samsung Electronics; Ms. Hyerim Yoo, Samsung Electronics; Ms. Eunyeong Oh, Samsung Electronics; Mr. Sungho Lee, Samsung Electronics

Large area imaging for metrology with high accuracy using Scanning Electron Microscope
Mr. Kyungbin Kim, Thermo Fisher Scientific; Ms. Eugene Kim, Thermo Fisher Scientific; Ms. Innyeong Choi, Thermo Fisher Scientific; Mr. Woo Jun Kwon, Thermo Fisher Scientific; Dr. Christopher H. Kang, Thermo Fisher Scientific

Voltage Free Failure Analysis of Sub-15nm DRAM Gate Insulator Breakdown based on Thermal Laser Stimulation
Ms. Chae Soo Kim, Samsung Electronics; Ms. Bohyeon Jeon, Samsung Electronics; Mr. Chiheon Byeon, Samsung Electronics; Mr. Seungchul Yew, Samsung Electronics; Mr. Dongin Lee, Samsung Electronics; Mr. Seguen Park, Samsung Electronics; Mr. Hyodong Ban, Samsung Electronics

Advanced axis correction for automated workflow of Vertical Scanning Electron Microscopy applications
Ms. Jooeun Lee, Thermo Fisher Scientific; Mr. Woo Jun Kwon, Thermo Fisher Scientific; Mr. In Chang Choi, Thermo Fisher Scientific; Dr. Christopher H. Kang, Thermo Fisher Scientific

Proposal for tilt-axis adjustment in V-NAND plan-view without Si substrate using automated metrology of Transmission Electron Microscope
Mr. Dong-yeob KIM, Thermo Fisher Scientific; Mr. Su-yeon Kim, Thermo Fisher Scientific; Mr. Woo Jun Kwon, Thermo Fisher Scientific; Dr. Min-kook kim, Thermo Fisher Scientific; Dr. Christopher H. Kang, Thermo Fisher Scientific

GEM-Water: Generation of EM-based Watermark for SoC IP Validation with Hidden FSMs
Mr. Pantha Protim Sarker, University of Florida; Mrs. Upoma Das, University of Florida; Mr. Mohammad Bin Monjil, University of Florida; Dr. Hadi Mardani Kamali, University of Florida; Prof. Farimah Farahmandi, Florida Institute for Cybersecurity, University of Florida; Prof. Mark M. Tehranipoor, Florida Institute for Cybersecurity, University of Florida; Dr. M Sazadur Rahman, Intel Corporation

Open localization with LIT
Dr. Marc van Veenhuizen, NXP Semiconductors; Dr. Jinbo Wan, NXP Semiconductors; Ms. Shuhan Yang, NXP Semiconductors; Mrs. Lei Peters-Wu, NXP Semiconductors

Autoencoder-based defect detection is applied to CAFM images of periodical structures
Dr. Alexey Solovey, NVIDIA; Dr. Chuan Zhang, NVIDIA Corporation

Effective Fault Localization Approach for High Speed Transceiver Failure: From Non-destructive to Destructive
Mrs. Lai Khei Kuan, Intel Corporation; Ms. Chiun Ning Liew, Intel; Mr. Lay Lay Goh, Intel Corporation; Mr. Jia Jun Wu, Intel Corporation; Mr. Sailesh C. Suthar, Intel Corporation; Mr. David Pivin, Intel

Application of Beam Deceleration to Improve SEM Image Quality for Physical Failure Analysis
Mr. Robert M Scott, Samsung Austin Semiconductor; Mr. Tim Schnutenhaus, Samsung Austin Semiconductor; Andres Torres, Samsung Austin Semiconductor, LLC; Mr. Nathan M McEwen, Samsung Austin Semiconductor; Mr. Kah Chin Cheong, Samsung Austing Semiconductor LLC.; Mr. Christopher Penley, Samsung Austin Semiconductor, LLC

The Sulfide Contamination Management In Circuit Probing FAB Clean Room Environment
Mr. Kuan-Jui Tu, Ardentec Corporation; Mr. Frank Su, Ardentec Corporation; Dr. Wen-Fei Hsieh, Ardentec Corporation; Mr. Vincent Chen, Ardentec Corporation; Mr. Henry Lin, Ardentec Corporation; Dr. Yung Song Lou, Ardentec Corporation

Automated algorithm of die filter for PFA sampling
Dr. Yougui Liao, Micron Technology; Mrs. Marsela Pontoh, Micron Technology; Mr. Tyler Lenzi, Micron Technology

The Influence of Temperature on Photoresist Profiles during TEM Sample Preparation using Cryo-FIB in Cold Temperature
Ms. Ji Hye Hyun, Thermo Fisher Scientific; Mr. Youngjin Cho, Thermo Fisher Scientific; Mr. Hyoungsic Cho, Thermo Fisher Scientific; Mrs. Seojin Kim, Thermo Fisher Scientific; Mr. In Chang Choi, Thermo Fisher Scientific; Mr. Beomjun Kim, Thermo Fisher Scientific; Dr. Yoonhae Kim, Thermo Fisher Scientific; Dr. Christopher H. Kang, Thermo Fisher Scientific

Inverter Characterization in Advanced Process by Nano-probing
Mr. Jui-Shen Tsai, Materials Analysis Technology; Mr. Chia-Hsiang Yen, Materials Analysis Technology; Mr. Dong-Ying Tzou, Materials Analysis Technology; Mr. Kuang-Tse Ho, Materials Analysis Technology

A Failure Caused by Extended Cross-Defect in DRAM
Mr. Jaehoon Lee, samsung electronics; Mrs. Kim jinseon, samsung electronics; Mr. Dongguk Han, samsung electronics; Mr. seunghun Lee, samsung electronics; Dr. Sunwoo Kim, samsung electronics; Mrs. Jingyeong Seol, samsung electronics; Mr. Seungjin Lee, samsung electronics; Mr. Kyoungrak Cho, samsung electronics; Dr. Nam incheol, samsung electronics; Mr. Daesun Kim, samsung electronics; Mr. Beomseop Lee, samsung electronics; Mr. Heeil Hong, samsung electronics; Mr. Sangjun Hwang, samsung electronics

Electron beam induced resistance change for isolation of wordline shorts in 3D replacement gate NAND
Mr. Chandler Rich, MS, BS, Micron Technology, Inc.

High-Precision Pulse Reflectometry-Based Fault Localization Approach for Advanced Chip Package Failures
Dr. Chuan Zhang, NVIDIA Corporation; Mr. John Aguada, NVIDIA Corporation

Fractographic case- studies of thinning related fracture- patterns in Silicon chips
Mr. Josef Maynollo, Infineon Technologies Austria

Spatial Resolution Enhancement of Time-Resolved Photon Emission Imaging with Superconducting Nanowire Single Photon Detector
Dr. Norimichi Chinone, Hamamatsu Photonics K.K.; Mr. Hirotoshi Terada, Hamamatsu Photonics K.K.; Dr. Tomonori Nakamura, Hamamatsu Photonics K.K.; Mr. Yoshiyuki Yokoyama, Hamamatsu Photonics K.K.; Mr. Toru Matsumoto, Hamamatsu Photonics K.K.

Magneto-Optic Kerr Imaging Technique for Localizing Magnetic Failures
Dr. Ricky Anthony, Analog Devices International; Mr. Jer O'Sullivan, Analog Devices International

Femtosecond laser tool for characterization of advanced packages
Dr. I.G.C. Weppelman, Gatan; Dr. S.T. Coyle, Gatan

Backside IC Preparation Down to STI Level Using Chemical Mechanical Polishing (CMP) with Highly Selective Slurry
Dr. Norbert Herfurth, IHP – Leibniz-Institut für innovative Mikroelektronik; Dr. Gerfried Zwicker, zwickerconsult; Awwal A. Adesunkanmi, IHP – Leibniz-Institut für innovative Mikroelektronik; Prof. Christian Boit, Technische Universitaet Berlin

In-situ Global Ultra Thinning of Live Chip Backside for Digital Forensic and Failure Analysis
Mr. Kees Schot, Netherlands Forensic Institution; Ms. Aya Fukami, University of Amsterdam, Netherlands Forensic Institution

ICCDLAB: Silicon Chip Tooling for Failure Analysis Laboratories
Mr. Thierry Parrassin, STMicroelectronics, ST Microelectronics; Mr. Nicolas Lysee, STMicroelectronics; Ms. Celine LE GLOANEC, STMicroelectronics; Mr. Sylvain Dudit, ST Microelectronics