2D and 3D Metrology and Failure Analysis for High Bandwidth Memory Package by Xe and Ar Plasma-FIB
2D and 3D Metrology and Failure Analysis for High Bandwidth Memory Package by Xe and Ar Plasma-FIB
Thursday, November 16, 2023: 8:00 AM
103 A-B (Phoenix Convention Center)
Summary:
We demonstrate the application of plasma-FIB/SEM techniques in 2D and 3D regimes and introduce diagonal serial sectioning at package scales as a novel approach for PFA and metrology. Both 2D and 3D analyses are performed for a high bandwidth memory (HBM) package case-study.
We demonstrate the application of plasma-FIB/SEM techniques in 2D and 3D regimes and introduce diagonal serial sectioning at package scales as a novel approach for PFA and metrology. Both 2D and 3D analyses are performed for a high bandwidth memory (HBM) package case-study.