Microscopy Analysis and Materials Characterization

Thursday, November 16, 2023: 8:00 AM-10:00 AM
103 A-B (Phoenix Convention Center)
Ms. Rose Ring, Thermo Fisher and Dr. Cecile S. Bonifacio, E.A. Fischione Instruments, Inc.
8:00 AM
2D and 3D Metrology and Failure Analysis for High Bandwidth Memory Package by Xe and Ar Plasma-FIB
Ms. Melissa Mullen, Thermo Fisher Scientific; Dr. Mark McClendon, Thermo Fisher Scientific; Dr. Adam Stokes, Thermo Fisher Scientific; Dr. Xiaoting Gu, Thermo Fisher Scientific; Mr. Peter Carleson, Thermo Fisher Scientific
8:20 AM
“Full” Automatic TEM from Imaging to Metrology
Dr. Yong Liu, Samsung Austin Semiconductor; Dr. Christopher Earl Carlton, Samsung Austin Semiconductor; Dr. Qi Zhang, Samsung Austin Semiconductor
8:40 AM
FIB-SEM tomography acquisition and data processing optimization for logic and memory structures
Dr. Heiko Stegmann, Carl Zeiss Microscopy GmbH; Mr. Alexandre Laquerre, Fibics Incorporated
9:00 AM
Expanding Failure Analysis using Fluorescence combined with IR and Raman
Mr. Jay Anderson, Photothermal Spectroscopy Corp.
9:20 AM
Mapping Conductivity and Electric Field in an AlGaAs HEMT with STEM EBIC
Dr. William A Hubbard, PhD, NanoElectronic Imaging, Inc.
9:40 AM
Complete Compressed Sensing System For Scanning Probe Microscopy
Dr. E.L. Principe, Synchrotron Research Inc.
See more of: Technical Program