Assessing Electronics with Advanced 3D X-ray Microscopy Techniques and Electron Microscopy
Assessing Electronics with Advanced 3D X-ray Microscopy Techniques and Electron Microscopy
Tuesday, November 14, 2023: 3:20 PM
103 A-B (Phoenix Convention Center)
Summary:
This paper presents advanced workflows that combine 3D X-ray microscopy (XRM), nanoscale tomography, and electron microscopy to generate a detailed visualization of the interior of electronic devices and assemblies, without destroying them, to enable the study of internal components for failure analysis (FA). Newly developed techniques such as the integration of deep-learning (DL) based algorithms for 3D image reconstruction are also discussed in this article. In addition, a new tool (called DeepScout) is introduced that uses high-resolution 3D XRM datasets as training data for lower-resolution, higher field-of-view datasets and scales larger-volume data using a neural network model. Ultimately, these workflows can be run independently or complementary to other multiscale correlative microscopy evaluations and will provide valuable insights into the inner workings of electronic packages and integrated circuits at multiple length scales, from macroscopic features on electronic devices (i.e., hundreds of mm) to microscopic details in electronic components (in the tens of nm). Understanding advanced electronic systems through X-ray imaging and electron microscopy, possibly complemented with additional correlative microscopy investigations, can speed development time, increase cost efficiency, and simplify FA and quality inspection of semiconductor packaging, printed circuit boards (PCBs), and electronic devices assembled with new emerging technologies.
This paper presents advanced workflows that combine 3D X-ray microscopy (XRM), nanoscale tomography, and electron microscopy to generate a detailed visualization of the interior of electronic devices and assemblies, without destroying them, to enable the study of internal components for failure analysis (FA). Newly developed techniques such as the integration of deep-learning (DL) based algorithms for 3D image reconstruction are also discussed in this article. In addition, a new tool (called DeepScout) is introduced that uses high-resolution 3D XRM datasets as training data for lower-resolution, higher field-of-view datasets and scales larger-volume data using a neural network model. Ultimately, these workflows can be run independently or complementary to other multiscale correlative microscopy evaluations and will provide valuable insights into the inner workings of electronic packages and integrated circuits at multiple length scales, from macroscopic features on electronic devices (i.e., hundreds of mm) to microscopic details in electronic components (in the tens of nm). Understanding advanced electronic systems through X-ray imaging and electron microscopy, possibly complemented with additional correlative microscopy investigations, can speed development time, increase cost efficiency, and simplify FA and quality inspection of semiconductor packaging, printed circuit boards (PCBs), and electronic devices assembled with new emerging technologies.