System in Package and 3D Devices

Tuesday, November 14, 2023: 3:20 PM-3:40 PM
103 A-B (Phoenix Convention Center)
Mr. Joseph Caroselli, Advanced Micro Devices, Inc. and Mr. Pradip Sairam Pichumani, Meta
3:20 PM
Assessing Electronics with Advanced 3D X-ray Microscopy Techniques and Electron Microscopy
Dr. Herminso Villarraga-Gómez, ZEISS
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