Backside FIB/SEM analysis strategy to identify a package related failure mode at an automotive magnetic sensor device

Tuesday, November 14, 2023: 3:20 PM
104 A-B (Phoenix Convention Center)
Mr. Michél Simon-Najasek , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Mr. Falk Naumann , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Mr. Achim Lindner , TDK-Micronas GmbH, Freiburg, Germany
Ms. Susanne Huebner , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Mr. Mickael Lejoyeux , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany
Mr. Frank Altmann , Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle, Germany

Summary:

This case study shows an analysis strategy how to get access to a failure mechanism caused by interaction between mold and IC which can not be easily solved by standard frontside investigation.
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