Case Studies: FA Process and Workflows II
Tuesday, November 14, 2023: 3:20 PM-4:40 PM
104 A-B (Phoenix Convention Center)
Dr. Wentao Qin, Microchip and Dr. Juntao Li, IBM Research
3:20 PM
Backside FIB/SEM analysis strategy to identify a package related failure mode at an automotive magnetic sensor device
Mr. Michél Simon-Najasek, Fraunhofer Institute for Microstructure of Materials and Systems IMWS;
Mr. Falk Naumann, Fraunhofer Institute for Microstructure of Materials and Systems IMWS;
Mr. Achim Lindner, TDK-Micronas GmbH;
Ms. Susanne Huebner, Fraunhofer Institute for Microstructure of Materials and Systems IMWS;
Mr. Mickael Lejoyeux, Fraunhofer Institute for Microstructure of Materials and Systems IMWS;
Mr. Frank Altmann, Fraunhofer Institute for Microstructure of Materials and Systems IMWS
