An Artificial Intelligence Powered Resolution Recovery Technique and Workflow to Accelerate Package Level Failure Analysis with 3D X-ray Microscopy

Thursday, November 16, 2023: 8:40 AM
104 A-B (Phoenix Convention Center)
Ms. Syahirah Mohammad Zulkifli , Advanced Micro Devices Pte Ltd, Singapore, Singapore
Ms. Bernice Zee , Advanced Micro Devices (AMD), Singapore, Singapore
Ms. Qiu Wen , Advanced Micro Devices (AMD), Singapore, Singapore
Mr. Allen Gu , Carl Zeiss Microscopy, Dublin, CA
Dr. Andriy Andreyev , Carl Zeiss Microscopy, Dublin, CA
Masako Terada , Carl Zeiss Microscopy, Dublin, CA
Ms. Yanjing Yang , ZEISS Research Microscopy Solutions, Singapore, Singapore
Mr. Maverique Ong , Advanced Micro Devices (AMD), Singapore, Singapore

See more of: Package Level Fault Isolation
See more of: Technical Program